Product Highlights:
OSP with carbon ink technique
Product parameter:
Layers | 2L board |
Material | FR-4 |
Thickness | 1.2mm+/-10% |
Surface processing | OSP+Carbon ink |
Copper thickness | 1 oz |
Drill hole(Min.) | 0.25mm |
Min. line space | 4mil |
Min. line width | 4mil |
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